#semiconductors

咨询顾问 Stephan Keese 的警告指出，受冲突驱动的氦气短缺可能波及半导体生产，并对汽车行业的 ADAS 普及形成压力。

一场长期的内存短缺可能会在未来数年持续挤压电子产品制造商。到 2027 年底，产量预计只能满足 60% 的需求，而新增产能大多将用于面向 AI 的内存。

Intel 全新的非 Ultra Core Series 3 处理器不再沿用旧设计翻新，而是引入了全新的 Wildcat Lake 芯片，并升级了 CPU、GPU、NPU、连接性和内存支持

研究人员描述了一种忆阻器设计，它在1,300华氏度下运行了超过50小时，并经受了超过10亿次开关循环，指向适用于极端环境的新型电子器件。

SiFive完成了一轮超额认购的4亿美元融资，由Atreides Management领投，这凸显了投资者对面向AI数据中心的开放RISC-V芯片设计的兴趣不断上升。

IEEE Spectrum的一篇报道聚焦了一种MEMS光子器件，它小到足以在极端微型化尺度上投射图像，其技术根源可追溯到量子计算硬件研究。

英特尔在新墨西哥州的业务正成为芯片产业中一个较少被关注领域的焦点：先进封装，它将更小的组件组合成定制系统，可能比晶圆制造更早带来收入。

Intel is casting advanced chip packaging as a core growth engine, arguing that the once-obscure manufacturing step could become one of the company’s most important businesses in the AI era.

Nvidia reported fiscal Q4 revenue of $68.1 billion, a 73% year-over-year surge, as hyperscalers collectively committed $650 billion in AI infrastructure spending for 2026. Despite the blowout results, investors remain cautious about whether the AI boom can sustain its breakneck pace.

Apple has revealed an unprecedented look at how its custom silicon is manufactured in the United States, showcasing the intricate process behind the chips powering iPhones and Macs. The disclosure comes as the tech giant deepens its domestic production commitments amid growing national interest in semiconductor self-sufficiency.

A carbon-nanotube-based abrasive achieves over one billion grit, smoothing semiconductor surfaces to within a few atoms while eliminating toxic slurry.

Engineers developed a carbon nanotube polishing method achieving atomic-level flatness on semiconductor surfaces. It is a next-gen chip breakthrough.