#semiconductors

सल्लागार Stephan Keese यांच्या इशाऱ्यानुसार, संघर्षामुळे निर्माण होणारी हीलियम टंचाई सेमीकंडक्टर उत्पादनावर परिणाम करू शकते आणि ऑटो उद्योगात ADAS स्वीकारण्यावर दबाव आणू शकते.

मेमरीची दीर्घकालीन टंचाई इलेक्ट्रॉनिक्स निर्मात्यांना अनेक वर्षे अडचणीत ठेवू शकते; 2027 अखेरीस उत्पादन केवळ 60 टक्के मागणी पूर्ण करेल, आणि नव्या क्षमतेचा मोठा भाग AI-केंद्रित मेमरीकडे वळत आहे.

इंटेलचे नवीन non-Ultra Core Series 3 प्रोसेसर जुन्या डिझाइनचे पुनर्वापर करण्याच्या पद्धतीपासून दूर जाऊन नवीन Wildcat Lake सिलिकॉन, अद्ययावत CPU, GPU, NPU, कनेक्टिव्हिटी आणि मेमरी सपोर्ट सादर करतात

Researchers describe a memristor design that operated for more than 50 hours at 1,300 degrees Fahrenheit and survived more than a billion switching cycles, pointing to new electronics for extreme environments.

SiFive has raised an oversubscribed $400 million round led by Atreides Management, underscoring growing investor interest in open RISC-V chip designs for AI data centers.

An IEEE Spectrum report highlights a MEMS photonics device small enough to project images at extreme miniaturization, with roots in quantum-computing hardware research.

Intel’s New Mexico operations are becoming a focal point for a quieter part of the chip business: advanced packaging, where smaller components are combined into custom systems that could bring revenue sooner than wafer-f

Intel is casting advanced chip packaging as a core growth engine, arguing that the once-obscure manufacturing step could become one of the company’s most important businesses in the AI era.

Nvidia reported fiscal Q4 revenue of $68.1 billion, a 73% year-over-year surge, as hyperscalers collectively committed $650 billion in AI infrastructure spending for 2026. Despite the blowout results, investors remain cautious about whether the AI boom can sustain its breakneck pace.

Apple has revealed an unprecedented look at how its custom silicon is manufactured in the United States, showcasing the intricate process behind the chips powering iPhones and Macs. The disclosure comes as the tech giant deepens its domestic production commitments amid growing national interest in semiconductor self-sufficiency.

A carbon-nanotube-based abrasive achieves over one billion grit, smoothing semiconductor surfaces to within a few atoms while eliminating toxic slurry.

Engineers developed a carbon nanotube polishing method achieving atomic-level flatness on semiconductor surfaces. It is a next-gen chip breakthrough.