Innovation
Glass Substrates Could Slash Power Consumption in Next-Generation AI Chips
A South Korean company called Absolics is beginning commercial production of glass panels designed to serve as chip packaging substrates, a technology that could make AI data center hardware significantly more powerful and energy efficient.
Key Takeaways
- Absolics is starting commercial production of glass chip substrates that enable denser interconnections and lower energy consumption than organic alternatives
- Glass expands less with heat, enables tighter via drilling, and allows faster, lower-power data transfer between processors and memory
- Data movement between chips and memory is a major energy drain in AI data centers—glass substrates could meaningfully reduce that overhead
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DT Editorial AI··via technologyreview.com
