#Intel

Los nuevos procesadores Core Series 3 no Ultra de Intel marcan un giro respecto a los diseños antiguos reutilizados e incorporan nuevo silicio Wildcat Lake con CPU, GPU, NPU, conectividad y compatibilidad de memoria actualizadas

Las operaciones de Intel en Nuevo México se están convirtiendo en el foco de una parte menos visible del negocio de chips: el empaquetado avanzado, donde componentes más pequeños se combinan en sistemas personalizados que podrían generar ingresos antes que la fabricación de obleas.

Intel is casting advanced chip packaging as a core growth engine, arguing that the once-obscure manufacturing step could become one of the company’s most important businesses in the AI era.

A South Korean company called Absolics is beginning commercial production of glass panels designed to serve as chip packaging substrates, a technology that could make AI data center hardware significantly more powerful and energy efficient.

ADR and Intel partner on underground edge AI deployments, bringing inference capabilities to locations where traditional data centers cannot operate.

Australian Droid + Robot partners with Intel to run real-time 3D scans and gas detection on rugged robots deep inside mines where connectivity is zero.