所有标记为「Intel」的文章
Intel 全新的非 Ultra Core Series 3 处理器不再沿用旧设计翻新，而是引入了全新的 Wildcat Lake 芯片，并升级了 CPU、GPU、NPU、连接性和内存支持
英特尔在新墨西哥州的业务正成为芯片产业中一个较少被关注领域的焦点：先进封装，它将更小的组件组合成定制系统，可能比晶圆制造更早带来收入。
Intel is casting advanced chip packaging as a core growth engine, arguing that the once-obscure manufacturing step could become one of the company’s most important businesses in the AI era.
A South Korean company called Absolics is beginning commercial production of glass panels designed to serve as chip packaging substrates, a technology that could make AI data center hardware significantly more powerful and energy efficient.
ADR and Intel partner on underground edge AI deployments, bringing inference capabilities to locations where traditional data centers cannot operate.
Australian Droid + Robot partners with Intel to run real-time 3D scans and gas detection on rugged robots deep inside mines where connectivity is zero.
