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Zeiss pitches a lower-damage FIB-SEM workflow for semiconductor failure analysis
Ahead of a June 10 virtual seminar, Zeiss is highlighting a new Crossbeam 750 FIB-SEM workflow aimed at cleaner endpointing, better signal quality, and lower sample damage in advanced chip analysis.
Key Takeaways
- Zeiss is promoting a Crossbeam 750 workflow for demanding semiconductor failure analysis tasks.
- The pitch centers on lower-damage low-kV finishing and cleaner live feedback during milling.
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DT Editorial Team··via events.bizzabo.com