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Intel Bets Advanced Packaging Can Pay Off Before Its Foundry Rebuild Does
Intel’s New Mexico operations are becoming a focal point for a quieter part of the chip business: advanced packaging, where smaller components are combined into custom systems that could bring revenue sooner than wafer-f
Key Takeaways
- Intel has restarted previously dormant capacity in New Mexico for advanced chip packaging.
- Company leadership says packaging may produce revenue before wafer fabrication ramps meaningfully.
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DT Editorial Team··via arstechnica.com