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Intel Bets Advanced Packaging Can Pay Off Before Its Foundry Rebuild Does
Key Takeaways
- Intel has restarted previously dormant capacity in New Mexico for advanced chip packaging.
- Company leadership says packaging may produce revenue before wafer fabrication ramps meaningfully.
- Talks with major custom-chip customers suggest packaging could become a key AI-era growth lever.
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DT Editorial Team··via arstechnica.com